Machining Challenges
In semiconductor applications, hard and brittle materials have always posed significant machining challenges:
- Silicon Carbide (SiC): With extremely high hardness, conventional silicon carbide wheels or general tools wear out quickly, often causing cracks and chipping, while also resulting in low machining efficiency.
- High-hardness brittle ceramics (Al₂O₃, ZrO₂, etc.): During grinding, they tend to produce rough surfaces, making it difficult to achieve smooth precision finishes. Edge breakage and workpiece damage may also occur.
Semiconductor
Our Solutions
Besdia — Diamond Tools Designed for Hard and Brittle Semiconductor Materials.
Developed by Best Diamond Industrial Co., Ltd., the latest Multi-layer Electroplated Technology offers breakthrough performance in precision machining:
Product Features
- Preserves exceptional cutting force:
Retains the high efficiency characteristic of traditional electroplated tools. - Extended Tool Life:
Overcomes the limitation of short lifespan in single-layer electroplating. - Effective cutting length design:
Multi-layer diamond arrangement provides self-sharpening ability, maintaining stable cutting performance without the need for external dressing. - Precision and stability:
Achieves the optimal balance between long tool life and high dimensional accuracy.
This technology is especially suitable for high-efficiency grinding and grooving of hard-brittle materials such as SiC, ZrO₂, and Si₃N₄, delivering longer service life and more consistent machining quality.
Applicable Materials / Application Examples
- Silicon Carbide (SiC): Forming, grinding, and groove machining
- Aluminum Oxide (Al₂O₃): Ceramic substrate grinding and precision polishing
- Gallium Nitride (GaN): High-precision groove and surface processing
- Quartz: Micro-structure drilling
- Zirconia (ZrO₂): Wear-resistant ceramic machining
- Graphite: Long-life engraving and finishing
Bond System Comparison Table
| Tool Type |
Technical Features | Tool Life | Machining Accuracy | Formability | Typical Materials / Applications |
| Electroplated (Single Layer) |
Single-layer diamond grains electroplated onto the substrate; offers the sharpest cutting edges and highest initial cutting efficiency; can be reclaimed and re-plated. |
Short |
Medium |
Excellent - easy to form |
Quartz; ceramics; micro-hole machining |
| Metal Bond |
Diamond grains sintered with metal powders; strong wear resistance; self-dressing capability. |
Long |
High |
Requires molds or EDM shaping |
Al2O3; quartz; through-hole machining; long-cycle grinding |
| Multi-layer Electroplated |
Combines electroplated sharpness with metal-bond-like service life; high-density diamond arrangement with self-sharpening behavior. |
Medium to Long |
Very High |
More design constraints |
SiC; ZrO2; Si3N4; high-efficiency grinding and precision grooving |
Recommended Products
01. Multi-layer Electroplated Diamond Tools
Feature:
Extremely strong cutting force, overcoming the short lifespan of traditional single-layer electroplated tools.Particularly suitable for high-speed, high-precision machining of hard-brittle semiconductor materials.
02. Metal Bond Diamond Tools
Feature:
High durability and long service life, ideal for long-duration, stable grinding and polishing operations.
03. Electroplated Bond Diamond Tools
Feature:
Exceptional cutting sharpness, easy to form, and fewer dimensional limitations.
Suitable for short-cycle machining, high cutting efficiency, and high-precision applications.